Hole sealing treatment of gold plated material

Abstract

PURPOSE: To sufficiently seal the pinhole parts of a gold plated material and to improve the corrosion resistance and wear resistance of the material by subjecting the surface of the blank material applied with gold or gold alloy plating to a pickling treatment as a pretreatment, then to a hole sealing treatment. CONSTITUTION: The blank material applied with the gold or gold alloy plating is immersed into a treating liquid, such as an org. amine, then the surface thereof is subjected to the hole sealing treatment. The above-mentioned blank material is subjected to the pickling treatment as the pretreatment at this time. Any acids, such as nitric acid, hydrochloric acid and sulfuric acid, which activate the underlying metal, may be used as the acid used therein. The reactivity and adsorptivity between the substrate in the pinhole parts and the hole sealing liquid are improved by this treatment, by which the pinhole parts are sufficiently sealed. The gold plated material having the excellent corrosion resistance and wear resistance is obtd. in this way. COPYRIGHT: (C)1991,JPO&Japio

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Cited By (2)

    Publication numberPublication dateAssigneeTitle
    JP-2010525169-AJuly 22, 2010エントン インコーポレイテッド金属表面の強化
    US-8002595-B2August 23, 2011Furukawa Electric Co., Ltd.Electrical contact material, method of manufacturing the same, and electrical contact