Thermocouple temperature signal measurement device and thermocouple temperature signal measurement method

热电偶温度信号测量装置及测量方法

Abstract

<b>本发明涉及一种热电偶温度信号测量装置及测量方法。目前用热电偶温度采集装置,灵敏度低,易受环境干扰信号的影响,也容易受前置放大器温度漂移的影响,不适合测量微小的温度变化。一种热电偶温度信号测量装置及测试方法,其组成包括</b><b>:</b><b>框架本体(</b><b>1</b><b>),所述的框架本体包括热电偶温度电路系统(</b><b>2</b><b>)、通信电路系统(</b><b>3</b><b>)、转换器(</b><b>4</b><b>)、</b><b>A/D</b><b>控制器(</b><b>10</b><b>),所述的通信电路系统包括复位电路器(</b><b>6</b><b>)、管理通信器(</b><b>9</b><b>)、译码电路器(</b><b>8</b><b>)、一组芯片(</b><b>7</b><b>),所述的热电偶温度电路系统分别与通信电路系统连接、</b><b>A/D</b><b>控制器连接,所述的通信电路系统与所述的转换器连接,所述的转换器与主站(</b><b>5</b><b>)连接。本发明用于热电偶温度信号测量装置。</b>
The present invention relates to a thermocouple temperature signal measurement device and a thermocouple temperature signal measurement method. A traditional thermocouple temperature acquisition device is low in sensitivity, is susceptible to environmental interference signals and the temperature drift of a preamplifier, and is not suitable for measurement of the tiny change of the temperature in the prior art. The thermocouple temperature signal measurement device comprises a frame body (1) consisting of a thermocouple temperature circuit system (2), a communication circuit system (3), a converter (4) and an A/D controller (10). The communication circuit system includes a reset circuit device (6), a management communication device (9), a decoding circuit device (8) and a group of chips (7). The thermocouple temperature circuit system is connected with the communication circuit system and the A/D controller, the communication circuit system is connected with the converter, and the converter is connected with a master station (5). The thermocouple temperature signal measurement method is used for the thermocouple temperature signal measurement device.

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